Commonly used in printed circuit board Black Oxide process, which prevents the generation of pink ring by reducing the CuO that dissolves easily in acid into Cu O.
It also acts as an accelerator in the electroless copper plating process, which produces electrons from DMAB and water reaction, and then reduces palladium ions (Pd ) into palladium molecules to be deposited on the cell wall .
Furthermore, it can be used in nickel, cobalt, molybdenum, silver, gold, zinc and other metal electroless plating, and the organic synthesis and pharmaceutical industries |
