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OSP

Surcoat

Cu-Coat GVIII

ZA 200 Microetchant

ECHEM Copper microetchant

EZ-GF0310

Antioxidants

ECHEM High resistant Lead-free organic solderability preservatives (OSP)

Product Description

Surcoat T / TX is an organic copper protective agent that has excellent heat resistance and moisture resistance properties. It is a water-soluble preflux specifically designed for heat and welding resistance of lead-free (Sn / Cu / Ag) solder surface of the printed circuit board.

Surcoat T / TX is also an organic OSP specifically designed for the lead-free soldering process that can withstand the impacts of high-temperature lead-free soldering (Peak Temp. 260 ℃, 3 times or more) several times and still retains excellent copper solder surface resistance (0.9 ~ 1.1? aperture PTHs, 99 ~ 100% rate on the tin).

Product Advantages

● low manufacturing cost, extend the life of the bath
● Surcoat TX is suitable for copper/gold mix board, and can operate without taping
● excellent flatness and pore uniformity
● bath solution is less prone to crystallization and does not produce oil
● suitable for surface copper treatment of wafer package
●great heat resistance -(260℃/ IR-Reflow more than 3 times)

● short processing time for T/TX bath
● maximum allowable limit of copper ions in a bath
● comply with environmental requirements
● compatible with disposable processes
● simple procedures and reduces cost

Surcoat OSP Operations flowchart

Maximum yield per unit

Surcoat OSP Sn 96.5%/Ag 3.0%/Cu 0.5% Solder
Flow-up Ratio for PTHs

Comparison chart of tolerance of
copper ions in anti-gold solution

Surcoat OSP Operation Flowchart

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